Thermal Pad Cooling Versatility Everywhere
Formulated with Nano Particles
Non-toxic and Non-corrosive
Versatile and Easy Application
Formulated with Nano Elements
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
Wide Range of Application
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
Dimensions (L x W x H) 95 x 45 mm
Thermal Conductivity 13.3 (W/m.K)
Density 3.4 ± 0.2 g/cc
Hardness 30~60 Sc
Breakdown Voltage 6KV (1mm)
Working Temperature -40 ~ 200°C